PCB mass production Imaging


The LIMATA X2000 Series is LIMATA’s direct imaging system platform designed for the imaging of Dry-Film and Solder Mask applications in high-volume PCB production environments.

LIMATA’s combined UV/IR imaging approach for solder mask applications accelerates the UV polymerization process and ensures significant higher throughput levels (surfaces per hour) on high-energy solder resist inks.

Fully-integrated single and dual-system automation options for an Island of Automation or in-line DI operation Setup can be provided.

Key system features

  • Direct imaging platform for the maskless direct imaging of green, black, blue, white and red colored solder resists
  • Integrated dual table system as standard hardware feature for higher production efficiency and throughput levels (panels/h)
  • Multi-wavelength LED set-up with >25.000 hours lifetime (MTBF)
  • Use of Multi-Wavelength UV-Light to optimize solder resist exposure
  • LIMATA’s proprietary UV/IR solder mask imaging technology accelerates imaging speed on all standard solder mask materials (i.e. Tayio)
  • RGB & IR camera lightning for easy fiducial detection on all solder mask colors
  • Highest optical depth of focus for an uniform power distribution on copper and base material
  • Unique modular imaging head concept provides for in-field system capacity upgrades (additional imaging units or IR modules)
  • Direct imaging capability on all standard solder resist types (i.e. Tayio)
  • Ease-of-use operator friendly data interface
  • Designed to minimize maintenance, downtimes and service costs over the entire DI equipment lifetime

Imaging technologies

  • High-speed Galvo-Scan Laser Technology or Real UV DMD/DLP chipse
  • UV- diode laser or multi-wavelength UV-LED setup
  • IR-Module (for solder mask applications) / LUVIR Technology
  • Highly telecentrical optical system incl. auto-focus functionality

Modular direct imaging set-up

  • Based on the specific solder mask ink type and color, energy levels (mJ/cm2) and direct imaging capacity requirements, the optimum UV-laser/LED and IR-imaging Setup can be selected and configured according to individual customer capacity needs
  • Possibility to conduct in-field upgrades for increased imaging capacities (additional imaging heads and IR modules) enabled by a modular „plug-in” concept.

Imaging and Software options


Advanced IC substrate capability down to
12 um / 0.6 mil Line / space with industrial

Partial Registration
Partial Registration

Detection of multiple fiducials for maximum registration accuracy


Automated tracking of individual Barcodes or serial numbers for full product traceability

MES interface
MES interface

MES-interface and Secs/Gem programming options (“real-time“ production data)

DI Automation (Island of Automation / In-line)

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI operation

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI in-line operation

PCB Applications (solder mask imaging)

Standard PCB and HDI

  • Standard (rigid)
  • Standard (flex)
  • Standard (rigid-flex)
  • Any layer PCB
  • mSAP (semi-additive)

Solder resist colors

  • Green
  • Black
  • Blue
  • White
  • Red