X1000
Universal and cost-efficient Direct Imaging (DI) system platform designed for the flexible use in PCB manufacturing environments for High-resolution dry-film patterning & most efficient solder mask imaging process (LUVIR)
X2000
Universal Direct Imaging (DI) system platform designed for the max. capacity by taking advantage of a double-drawer system to minimze the process cycle steps (4 to 1). Optional, XXL boards up to 48″ / 1,22 m can be processed in one step on the system too.
X3000
Worldwide largest Direct Imaging (DI) system platform designed for the efficient processing of oversized PCB panels
110”x 48” board sizes can be processed in one step, endless board manufacturing alternatevely and mass production with a load capacity of up to 12 x 24″x18″ panels in parallel.
X1000A
Fully modular and flexible adaptable in-house developed single and twin automation for an rigid board in-Line direct imaging process operation for solder mask and outer layer production.
Universal and cost-efficient Direct Imaging (DI) system platform designed for the flexible use in PCB manufacturing environments for High-resolution dry-film patterning & most efficient solder mask imaging process (LUVIR)
Fully modular and flexible adaptable in-house developed single and twin automation for an rigid board in-Line direct imaging process operation for solder mask and outer layer production
Universal Direct Imaging (DI) system platform designed for the max. capacity by taking advantage of a double-drawer system to minimze the process cycle steps (4 to 1). Optional, XXL boards up to 48″ / 1,22 m can be processed in one step on the system too.
Worldwide largest Direct Imaging (DI) system platform designed for the efficient processing of oversized PCB panels
110”x 48” board sizes can be processed in one step, endless board manufacturing alternatevely and mass production with a load capacity of up to 12 x 24″x18″ panels in parallel.