Versatile direct imaging platform for electronics that protect, power, connect, and heal.
Designed to deliver advanced imaging for high-reliability PCB and precision manufacturing
Resist patterning
Standard and HDI printed circuit boards ∙ Semi ∙ Chemical milling
Solder mask imaging
DI solder masks ∙ Conventional solder masks
Oversized XXL panel imaging
24” × endless ∙ 48 × 110”
Resist patterning
Finest lines at 2-3x throughput per head
PX4K - Industry-leading exposure speed for resist patterning
Highest efficiency per exposure head → lowest TCO
Superior imaging quality and yields on challenging topographies
Standard and HDI printed circuit boards
Chemical milling
Semi wafer and advanced packaging
Truly material agnostic
High-speed resist patterning and finest lines on a wide range of dry-film materials
Specs
Perfect circuitry — even under the SEM
Standard PCB and HDI — down to 30µm L/S
Fine line imaging — down to 10 µm L/S
Direct copper bonded — down to 30 µm L/S
Chemical milling — patterns down to 15 µm
Liquid resist — wafer patterns down to 2 µm
50 µm L/S
Dry film ∙ DuPont™ LDI7040
30 µm L/S
Dry film ∙ KOLON LW 8129
10 µm fine lines
Dry film ∙ KOLON LS 9015
2 µm wafer patterns
400x zoom ∙ SPIN coated liquid resist
Direct copper bonded
25 µm patterns on stainless steel
PX 4K — highest resist imaging throughput with fewer exposure heads
80% larger exposure field ∙ 50% fewer scans ∙ Way shorter exposures
Unmatched imaging efficiency, speed and quality
1-3 heads — upgradable in the field
PX Technology
Exposure cycle time*
per side of a panel (24 x 18”) ∙ resist patterning (inner/outer layers)
* exposure time only (excluding panel load/unload and registration time) depending on resist type and coating process
Solder mask imaging
Best-in-class solder mask imaging — DI or conventional inks
Truly all inks — no process or material changes required
Coating thickness up to 150 µm (6 mil)
Consistent quality and high yields — regardless of material, ink type, or copper thickness
DI solder masks
Conventional solder masks
All ink types, colors and brands
Specs
Superior quality and yield in solder mask imaging
Minimal undercut ∙ Best solder dam quality ∙ High quality-sidewalls
Excellent surface and edge quality
Best imaging uniformity ∙ Superior imaging accuracy
50 µm solder dam
50 μm SM wet coating thickness
Rectangular dam shape
Minimal undercut ∙ Slight growth
Sidewall profile on small feature
±12 µm (0.5 mil) registration accuracy
PX 4K and PX LUVIR® — fastest solder mask imaging
PX4K ∙ 80% larger exposure field ∙ Less scans ∙ Way shorter exposures ∙ DI inks
PX LUVIR® ∙ Patented, award-winning imaging technology for conventional solder mask
1-3 heads — upgradable in the field
PX Technology
Exposure cycle time*
per side of a panel (24 x 18”)
* exposure time only (excluding panel load/unload and registration time) depending on solder type, coating process (incl. thickness) and post-processes which may affect UV-energy dose levels and cycle times
Oversized XXL panel imaging
Unrivaled adaptability — from 24” × endless to 48 × 110”
Oversized boards for special applications
X1000 Endless — max. 24” × endless
X2000 XL — max. 24 × 48”
X3000 — max. 48 × 110” / 48 × endless / 12 panels 18 × 24” at once
Compare formats
Partial and fluid multi-point alignment
TCO* and OEE**
Industry-leading direct imaging efficiency. Reduced complexity. Lower TCO*
Highest imaging speed and efficiency
2-3x higher imaging throughput per head enabled by fewer scans over the imaging area
2x higher throughput on conventional solder mask inks enabled by UV+IR imaging
Outstanding imaging quality for superior yields
Best line quality on challenging topographies thanks to 3x higher depth of focus (±500 µm)
Excellent surface and solder mask imaging quality thanks to 3‑wavelength spectrum
Best-in-class availability and reliability
Real-time visibility and predictive control (sensor and SW enabled)
Predictive maintenance capability reduces service and maintenance costs
Lowest TCO* over the equipment lifecycle
Reduced system complexity — from fewer heads
Lower initial CapEx, simplified service and reduced after-sales costs
* Total cost of ownership: all costs of the machine lifecycle inc. maintenance, spare parts and service
** Overall equipment effectiveness: machine performance, quality and availability
X series
Discover the X series models
From short-run to mass production
From standard PCBs dimensions to world-largest oversize boards
All models include PX imaging technology
X1000
Compact, versatile DI system for short-run, QTA to high-volume (turnkey automated), and diverse resist/solder mask applications
1-3 PX heads
Single table
24 × 32” max. exposure area
24” × endless
Automation options
X1000A — Island of automation or in-line
X1000 R2R — Flex (FPCB) reel-to-reel
Discover X1000
X2000
Flexible DI model equipped with a dual-table system and designed for continuous mid- to high-volume production
1-3 PX heads
Dual table
24 × 26” max. exposure area — X2000 Standard
24 × 48” max. exposure area — X2000 XL — 2nd table
Automation options
X2000A — Island of automation or in-line
Discover X2000
X3000
World’s largest DI system supporting oversized panels up to 48“ x 110“ or multiple panels in a single exposure run
1-3 PX heads
Single table with 4 vacuum zones
48 × 110” max. exposure area
Up to 12x (18 × 24”) panels in one imaging run
Discover X3000
Get to know us
About us
15+ years
of engineering excellence and direct imaging innovation
Since 2010
100+
100+ installations worldwide, with a proven track record across industries
North America, Europe and Asia
4
Sales, service and support centers. Partnerships in all key manufacturing regions
Get in touch
Limata GmbH
Gutenbergstr. 4, 85737 Ismaning, Germany
info@limata.de
+49 89 21 90 91 130
Let’s discuss your production needs
Tell us about your direct imaging requirements and we’ll configure a Limata system tailored to your process — down to the details
Get in touch