Any volume and product stage — from prototyping and short-run to mass-production

Any panel size and type — from standard (18 x 24") to oversized (48 x 110") — rigid or flex

Modular and scalable — tailored configurations from 1 to 3 heads — upgradable in the field

Manual or turnkey automated — seamlessly scale to high-volume without process transfer

2.5x higher speed and throughput per imaging head* — more capacity with fewer exposure engines

Sharpest circuitry — highest line precision, uniformity and superior yields — even for the most challenging PCB designs and topographies

All PCB applications — from standard and advanced PCBs to ultra-fine line patterning and solder mask imaging — across diverse material types

* Compared to standard DMD LED and laser-based DI systems

Highest imaging speed and efficiency — prints per head

Outstanding imaging quality and consistency for superior yields

Best-in-class availability and reliability — advanced predictive control capabilities paired with unmatched MTBF/MTTR (PX tech) maximize uptime

Reduced system complexity through fewer heads — lower CapEx, simplified service and reduced aftersales costs over the equipment lifecycle (TCO)

* Total cost of ownership