LUVIR Technology ®
The task of direct imaging for conventional / standard solder mask in the PCB process has ever been challenging, since solder mask needs significant higher amounts of UV-energy compared to dry-film. Process times of current direct imaging / multi-wavelength technologies are still not suitable for high-volume requirements.
In order to tackle this task, Limata has developed a completely new approach for solder mask exposure. The LUVIR Technology ® is a unique combination of both UV-Light and IR-Laser Power where the IR serves to heat up the ink directly before the UV–Light starts the polymerization. The heat makes the solder mask ink more reactive for the polymerization process, which significantly reduces the UV-Power needed for the complete polymerization of the ink. This results in a faster and more efficient solder mask imaging process at higher capacity levels (prints / hour) with no compromises on surface quality, resolution and accuracy.
Higher capacity levels with LUVIR are particularly achieved on all conventional solder mask ink types and colours (i.e. green / black) requiring high-UV energy doses between 400 – 1,000 mJ/cm2, and accounting for ca. 90% of the total inks used in the standard PCB solder mask process. The continuous further use and imaging of PCB customer’s process proven conventional solder mask inks secures process stability, protects yields and saves material costs (vs. converting to more expensive DI inks) on a PCB factory level.
LUVIR is available on all LIMATA X-system platforms in modular imaging configurations according to each PCB customers’ individual capacity requirements, PCB product mix and equipment budget.
Customer Value proposition (PCB solder mask departments)
Imaging speed and accuracy
Higher panel processing capacity (prints/h) on all conventional ink types from use of unrivalled LUVIR imaging efficiency
High resolution capability (down to 2mil dams) and registration accuracy
Modular and cost efficient LDI system platform
(X-Series with LUVIR inside)
Availability of modular imaging capacity concepts on three system platforms (X1000/ X2000/ X3000) with capacity options ranging from 1-4 UV/IR imaging units
Each system configured to PCB factory‘s real imaging processing requirement (no need to buy imaging capacity which is not needed)
Initial hardware set-up provides for future imaging capacity upgrades (field-upgrade capability)
„Ease-of use“ and operator friendly handling
Reliability and lower Cost of Ownership
Reliable and stable DMD/DLP real UV-chipsets with UV-LED / Laser &IR laser imaging set-up supports longer equipment uptime at lower maintenance and replacement costs over the equipment life-cycle
No change of ink and process adjustments from use of LDI needed
Higher capacity levels with LUVIR direct imaging on all conventional solder mask ink types, enable PCB manufacturers to further use and expose their end customer approved conventional inks at lower ink material costs (vs. converting to DI inks)
Award winning technology (PCB & EMS 2019)
For more information on our latest LUVIR technology and how we can support your solder mask exposure process, please email us at email@example.com or fill out the below form