X 1000

X1000

Universal and cost-efficient Laser Direct Imaging (LDI) system platform
designed for the flexible use in high-mix/low-volume PCB manufacturing environments during the dry-film patterning or solder mask imaging process

Description

The LIMATA X1000 series is a universal and cost-efficient Laser Direct Imaging (LDI) system platform designed for the flexible use in high-mix/ low-volume PCB manufacturing environments during the dry-film patterning or solder mask imaging process.

The new X1000 LDI system platform ensures maximum efficiency and throughput – i.e. from the use of LIMATA’s proprietary and in-house developed LUVIR (UV/IR) technology for solder mask imaging – at lowest possible TCO’s (Total Cost of Ownership) over the equipment life-cycle. Ideal for PCB manufacturers (or special PCB divisions of larger PCB makers) with high-mix/low-volume production mixes and imaging capacity/output requirements up to 500 panels per day (HDI, standard-rigid, flex) in a multi-shift operational mode. The use of LIMATA’s in-house developed LUVIR technology ensures competitive

An optimized system operations footprint further provides for an easier placement and system movement within each facility.

Fully-integrated single and reel-to-reel automation (for flexible PCB’s) options can be provided upon request.

Key system features

  • New flexible laser direct imaging platform for the maskless direct imaging of green, black, blue, white and red colored solder mask inks and dry-film resists (conventional and DI inks)
  • UV-laser set-up with >18.000 hours lifetime (MTBF)
  • LIMATA’s proprietary and in-house developed LUVIR (UV/IR) solder mask imaging technology accelerates imaging speed on all standard / conventional solder mask materials, ensuring a continuous use of conventional ink types in the solder mask process (no requirement for DI inks)
  • RGB & IR camera lightning for easy fiducial detection on all solder mask colors
  • Laser mirror system with perfect power dissipation (no water cooling/ no power limitations)
  • Highest optical depth of focus for an uniform power distribution on copper and base material
  • Unique modular imaging head concept provides for in-field system capacity upgrades (additional imaging units or IR modules)
  • Direct imaging capability on all conventional standard mask ink types (i.e. Tayio) at highly competitive throughput capacity levels
  • Ease-of-use operator friendly data interface
  • Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime

Laser and imaging technologies

  • High-speed Galvo-Scan Laser Technology
  • UV- diode laser set-up with 4/6 laser configurations per exposure unit
  • IR-Module (for solder mask applications) / LUVIR Technology
  • Highly telecentrical optical system

Modular laser direct imaging set-up

  • Based on the specific solder mask ink type and color, energy levels (mJ/cm2) and direct imaging capacity requirements, the optimum UV-laser and IR-imaging Setup (ranging from 1 to 2 laser exposure heads and IR modules per system) can be selected and configured according to individual customer capacity needs
  • Possibility to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads and IR modules) enabled by a modular „plug-in” concept.

X1000 - Options

HR-Option
HR-Option

Adjustable laser spot size for advanced HDI production (High-Resolution)

Partial Registration
Partial Registration

Detection of multiple fiducials for maximum registration accuracy

Traceability
Traceability

Automated tracking of individual Barcodes or serial numbers for full product traceability

MES interface
MES interface

MES-interface and Secs/Gem programming options
(“real-time“ production data)

LDI Automation (Island of Automation / In-line)

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI operation
Automation

The X1000 platform can be complemented by a robotic set-up or a Reel-to-Reel (R2R) automation and handling system for Flex PCB’s.

PCB Applications

Standard PCB and HDI

  • Standard (rigid)
  • Standard (flex)
  • Standard (rigid-flex)
  • Any layer PCB
  • mSAP (semi-additive)

Solder mask inks

(conventional and DI inks)

  • Green
  • Black
  • Blue
  • White
  • Red

Data-Sheets (X1000)