PCB Solder Mask Imaging

Description

The LIMATA X2000 SM Series is LIMATA’s latest laser direct imaging system platform designed for the imaging of Solder Mask applications in high-volume PCB production environments.

LIMATA’s combined UV/IR imaging approach for solder mask applications accelerates the UV polymerization process and ensures significant higher throughput levels (surfaces per hour) on high-energy solder resist inks.

Fully-integrated single and dual-system automation options for an Island of Automation or in-line LDI operation Setup can be provided.

Key system features

  • New flexible laser direct imaging platform for the maskless direct imaging of green, black, blue, white and red colored solder resists
  • Integrated dual table system as standard hardware feature for higher production efficiency and throughput levels (panels/h)
  • Multi-wavelength laser set-up with >18.000 hours lifetime (MTBF)
  • Use of three different laser-wavelengths to optimize solder resist exposure
  • LIMATA’s proprietary UV/IR solder mask imaging technology accelerates imaging speed on all standard solder mask materials (i.e. Tayio)
  • RGB & IR camera lightning for easy fiducial detection on all solder mask colors
  • Laser mirror system with perfect power dissipation (no water cooling/ no power limitations)
  • Highest optical depth of focus for an uniform power distribution on copper and base material
  • Unique modular imaging head concept provides for in-field system capacity upgrades (additional imaging units or IR modules)
  • Direct imaging capability on all standard solder resist types (i.e. Tayio)
  • Ease-of-use operator friendly data interface
  • Designed to minimize maintenance, downtimes and service costs over the entire LDI equipment lifetime

Laser and imaging technologies

  • High-speed Galvo-Scan Laser Technology
  • UV-Multiwave diode laser set-up with three different wavelenghts
  • IR-Module (for solder mask applications)
  • High-telecentrical optical system

Modular laser direct imaging set-up

  • Based on the specific solder resist type and color, energy levels (mJ/cm2) and direct imaging capacity requirements, the optimum UV-laser and IR-imaging Setup (ranging from 1 to 4 laser exposure heads and IR modules) can be selected and configured according to individual customer needs
  • Possibilty to conduct in-field laser upgrades for increased imaging capacities (additional imaging heads and IR modules) enabled by a modular „plug-in“ concept
4 Imaging Heads SM

Imaging and Software options

HR-Option
HR-Option

Adjustable laser spot size for advanced HDI production (High-Resolution)

Partial Registration
Partial Registration

Detection of multiple fiducials for maximum registration accuracy

Traceability
Traceability

Automated tracking of individual Barcodes or serial numbers for full product traceability

MES interface
MES interface

MES-interface and Secs/Gem programming options (“real-time“ production data)

LDI Automation (Island of Automation / In-line)

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI operation
Automation

The X2000 platform can be complemented by a robotic set-up for a fully automated and less labor intensive LDI in-line operation

PCB Applications (solder mask imaging)

Standard PCB and HDI

  • Standard (rigid)
  • Standard (flex)
  • Standard (rigid-flex)
  • Any layer PCB
  • mSAP (semi-additive)

Solder resist colors

  • Green
  • Black
  • Blue
  • White
  • Red

Data-Sheets (X2000SM)